Hewlett-Packard Building 2 Fast Fab

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The 27,000 SF class 1,000 computer chip manufacturing ballroom with Class 1 mini-environments was constructed within an existing 350,000 SF building adjacent to an operating high-volume FAB and occupied support facility. 27,000 SF of support space was constructed beneath the clean room on a steel frame mezzanine and a new 54,200 SF energy center was added containing manufacturing process systems and services. Work was performed on a Fast Track Schedule, and the project was completed five weeks ahead of schedule.

Location

Corvallis, OR

Owner

Hewlett-Packard

Architect

IDC

Square Footage

27,000 SF